Unexpected Reduction in Thermal Conductivity Observed in Graphene/H-BN Heterostructure
Zhang Wu, Rumeng Liu, Ning Wei, Lifeng Wang
Abstract: Heterostructures find wide-ranging applications in fields such as thermal management, thermoelectric energy conversion, and nanoelectronics. This study provides new insights into the thermal conductivity of parallel heterointerfaces by investigating a longitudinal heterostructure composed of graphene and hexagonal boron nitride (h-BN) using molecular dynamics simulations. Interestingly, it is observed that this unique heterostructure possesses a lower thermal conductivity compared to pure h-BN. The analysis reveals that phonon scattering is enhanced by stress at the interface of the heterostructure and the mass distribution through it. The heterostructure model introduced in this study presents new insights for controlling phonon transportation in nanoscale structures.
文章链接：https://pubs.rsc.org/en/content/articlelanding/2024/cp/d3cp05407a
